d a t a sh eet product data sheet supersedes data of 2000 jul 03 2004 dec 14 discrete semiconductors bst39; bst40 npn high-voltage transistors db ook, halfpage m3d109
2004 dec 14 2 nxp semiconductors product data sheet npn high-voltage transistors bst39; bst40 features ? low current (max. 100 ma) ? high voltage (max. 350 v). applications ? general purpose switching and amplification. description npn high-voltage transistor in a sot89 plastic package. pnp complements: bst15 and bst16. marking pinning type number marking code bst39 at1 bst40 at2 pin description 1 emitter 2 collector 3 base 321 sym04 2 1 2 3 fig.1 simplified outline (sot89) and symbol. ordering information type number package name description version bst39 sc-62 plastic surface mounted package; collector pad for good heat transfer; 3 leads sot89 bst40
2004 dec 14 3 nxp semico nductors product data sheet npn high-voltage transistors bst39; bst40 limiting values in accordance with the absolute maximum rating system (iec 60134). note 1. device mounted on a printed-circuit board, single-sided copper, tin-plated, mounting pad for collector 6 cm 2 . for other mounting conditions, see ?thermal considerations for sot89 in the general part of associated handbook?. thermal characteristics note 1. device mounted on a printed-circuit board, single-sided copper, tin-plated, mounting pad for collector 6 cm 2 . for other mounting conditions, see ?thermal considerations for sot89 in the general part of associated handbook?. characteristics t amb = 25 c unless otherwise specified. symbol parameter conditions min. max. unit v cbo collector-base voltage open emitter bst39 ? 400 v bst40 ? 300 v v ceo collector-emitter voltage open base bst39 ? 350 v bst40 ? 250 v v ebo emitter-base voltage open collector ? 5 v i c collector current (dc) ? 100 ma i cm peak collector current ? 200 ma i bm peak base current ? 100 ma p tot total power dissipation t amb 25 c; note 1 ? 1.3 w t stg storage temperature ? 65 +150 c t j junction temperature ? 150 c t amb ambient temperature ? 65 +150 c symbol parameter conditions value unit r th(j-a) thermal resistance from junction to ambient note 1 96 k/w r th(j-s) thermal resistance from junction to soldering point 16 k/w symbol parameter conditions min. max. unit i cbo collector-base cut-off current i e = 0 a; v cb = 300 v ? 20 na i ebo emitter-base cut-off current i c = 0 a; v eb = 5 v ? 100 na h fe dc current gain i c = 20 ma; v ce = 10 v 40 ? v cesat collector-emitter sa turation voltage i c = 50 ma; i b = 4 ma ? 500 mv c c collector capacitance i e = i e = 0 a; v cb = 10 v; f = 1 mhz ? 2 pf f t transition frequency i c = 10 ma; v ce = 10 v; f = 100 mhz 70 ? mhz
2004 dec 14 4 nxp semico nductors product data sheet npn high-voltage transistors bst39; bst40 package outline references outline version european projection issue date iec jedec jeita dimensions (mm are the original dimensions) sot89 to-243 sc-62 04-08-03 06-03-16 w m e 1 e e h e b 0 2 4 mm scale b p3 b p2 b p1 c d l p a plastic surface-mounted package; collector pad for good heat transfer; 3 leads sot8 9 123 unit a mm 1.6 1.4 0.48 0.35 c 0.44 0.23 d 4.6 4.4 e 2.6 2.4 h e l p 4.25 3.75 e 3.0 w 0.13 e 1 1.5 1.2 0.8 b p2 b p1 0.53 0.40 b p3 1.8 1.4
2004 dec 14 5 nxp semico nductors product data sheet npn high-voltage transistors bst39; bst40 data sheet status notes 1. please consult the most recently issued document before initiating or completing a design. 2. the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. the latest pr oduct status information is available on the internet at url http://www.nxp.com. document status (1) product status (2) definition objective data sheet development this document contains data from the objective specification for product development. preliminary data sheet qualification this document contains data from the preliminary specification. product data sheet production this document contains the product specification. disclaimers general ? information in this docu ment is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shal l have no liability for the consequences of use of such information. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, airc raft, space or life support equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for incl usion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are fo r illustrative purposes only. nxp semiconductors makes no representation or warranty that su ch applications will be suitable for the specified use without further testing or modification. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) may cause permanent damage to the device. limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the characteristics sections of this document is not implied. expo sure to limiting values for extended periods may af fect device reliability. terms and conditions of sale ? nxp semico nductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile /terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by nxp semiconductors. in case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. no offer to sell or license ? nothing in th is document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. quick reference data ? the quick refere nce data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not complete, exhaustive or legally binding.
nxp semiconductors contact information for additional information please visit: http://www.nxp.com for sales offices addresses send e-mail to: salesaddresses@nxp.com ? nxp b.v. 2009 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reli able and may be changed without notice. no liabilit y will be accepted by the publisher for any consequen ce of its use. publicat ion thereof d oes not con vey nor imply any license under patent- or other industrial or intellectual property rights. customer notification this data sheet was changed to reflect the new company name nxp semiconductors, including new legal definitions and disclaimers. no changes were made to the technical content, except for package outline drawings which were updated to the latest version. printed in the netherlands r75/05/pp6 date of release: 2004 dec 14 document order number: 9397 750 13876
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